ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,798, issued on July 28, was assigned to Intel Corp. (Santa Clara, Calif.). "Active device layer at interconnect interfaces" was invented by... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,799, issued on July 28, was assigned to BONDTECH Co. LTD. (Kyoto, Japan). "Bonding method, bonded article, and bonding device" was invented... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,800, issued on July 28, was assigned to Intel Corp. (Santa Clara, Calif.). "Microelectronic assemblies including solder and non-solder inte... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,801, issued on July 28, was assigned to Intel Corp. (Santa Clara, Calif.). "Package architecture with compute bricks having vertically stac... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,802, issued on July 28. "Semiconductor device assembly with through-package interconnect and associated systems, devices, and methods" was ... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,803, issued on July 28, was assigned to nD-HI Technologies Lab Inc. (Taipei City, Taiwan) and ETRON TECHNOLOGY INC. (Hsinchu, Taiwan). "Die... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,804, issued on July 28, was assigned to Intel Corp. (Santa Clara, Calif.). "Multichip IC devices with die embedded in glass substrate and a... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,805, issued on July 28, was assigned to Samsung Display Co. Ltd. (Yongin-si, South Korea). "Display device" was invented by Yuk Hyun Nam (C... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,806, issued on July 28, was assigned to LG Electronics Inc. (Seoul, South Korea). "Method for manufacturing semiconductor light-emitting de... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,807, issued on July 28, was assigned to Intel Corp. (Santa Clara, Calif.). "Architectures for backside power delivery with stacked integrat... Read More